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High-Performance CPC313 Processor Module for Embedded Applications

Advanced Computing Devices

Manufacturer:DOLOMANT OJSC

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Description

The product is made in StackPC standard based on Baikal-T1 processor (K1925VM018) operating at frequencies up to 1.2 GHz and is designed for embedded applications requiring high performance and low power consumption. The product contains a soldered SSD disc, interfaces: StackPC, PCI-104, LVDS, VGA, which allows you to build systems as stack (connecting with each other), forming a compact computing system, and on the basis of COM technology, installing a carrier board on which the interface connectors and other functional nodes are brought out, forming a computing system.

Specifications

Processor

Baikal-T1

RAM

Soldered DDR3-800 MHz: 4GB

U-Boot

16 Mbytes; system upgradeable.

Two Serial ATA III drive interfaces

The first channel (6Gbps in the current version) is routed to an 8GB SSD; the second channel (3Gbps) is routed to a StackPC connector.

Video controller SM750

2D accelerator; video memory capacity not more than - 16 Mbytes; possibility to connect LCD panels (LVDS 18bit/24bit) with resolution not more than - 1920 × 1080 pixels and monitors with VGA interface with resolution not more than - 1920 × 1080 pixels.

Ethernet

Two 10/100/1000 Mbit interfaces (StackPC connector)

PCIe x1 Gen 2 ports (StackPC connector)

5 pieces; support PCI Express r2.0 specification

PCI interface (PCI-104 connector)

Support PCI-104 specification for 32-bit/33MHz bus; support up to four bus master devices.

USB 2.0 ports

Two ports available on board; four ports available on StackPC connector; support booting OS from USB media.

Two UART ports according to 16550 standard

COM1: RS-232 (up to 115.2 Kbit/s) output on the board (designed for console I/O when no expansion board is available. COM1: RS232 multiplexed with COM1: TTL UART); COM1, COM2: (up to 115.2 kbps) TTL UART brought out to StackPC connector; console input

I2C interface (StackPC connector)

Armoured glass

Real Time Clock

Armoured glass

Software compatibility with OS

QNX: 6.x; Linux Debian 9 (kernel 4.4.182); Neutrino ZOSRV

Consumption current

Not more than 3000 mA

MTBF (Mean Time Between Failures)

Not less than 160 000 hours

Dimensions

Not more than 116.1 × 96.4 × 29.5 mm (CPC313-01); not more than 116.1 × 96.4 × 30.7 mm (CPC313-02).

Module weight

Not more than 0.320kg for (CPC313-01); not more than 0.350kg for (CPC313-02).

Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.

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Shipping Terms

FOB Novorossiysk, RussiaCIF Available to major ports worldwideEXW Manufacturer's facility, Russia

Delivery Time

Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)

Payment Methods

Letter of Credit (L/C)Wire Transfer (T/T)Escrow Services

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High-Performance CPC313 Processor Module for Embedded Applications

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