Industrial-Oriented Technological Complex Cluster TM 200 for Advanced 180-90nm Electronic Component Manufacturing

Purpose:

Realisation of 180 - 90 nm level technologies.

Features:

The cluster is designed for realisation of basic technological processes (BTP) in production of a wide range of electronic component base (ECB) at the enterprises of radio-electronic industry. The cluster consists of process modules and a robotic vacuum-transport system for automated movement of wafers with a diameter of 150,200 mm between process modules with loading/unloading of wafers from cassettes or SMIF-containers.

Any of the eight technological (process) modules of the plants can be docked to the cluster complex, such as:

Magna TM 200-01K, Magna TM 200-04K, Plasma TM 200-01K, Plasma TM 200-02K, Plasma TM 200-03K, Plasma TM 200-04K, Isofaz TM 200-01K, Isofaz TM 200-02K, BTO TM 200-01K.