Vacuum spraying unit "Oratoria 29M", designed for application of
metal films of aluminium, titanium, nickel, molybdenum on silicon wafers for microelectronics with diameter 76 mm.
microelectronics with a diameter of 76 mm and 100 mm.
The unit provides:
-automatic pumping of the working chamber, airlock chamber
wafer loading chamber, wafer sluice chamber, wafer unloading chamber and gas inlet into them;
-automatic loading of wafers on the conveyor from the cassette
and unloading of wafers into the cassette;
-capacity of not less than 100 wafers per hour without taking into account the time of
pumping time of sluice chambers;
-time to reach residual pressure of 1.33 x 10-2 Pa in the working chamber
from the moment of opening of the high-vacuum gate not more than 30 min;
-regulation of conveyor speed in the range
from 120 to 400 mm/min;
-regulation of halogen lamp current
KG 220-2000-2 plate heating in the range from 3 to 6 A;
-regulation of argon pressure in the deposition zone
in the range from 0.4 to 1.3 Pa;
-operation of three magnetrons in the range of power
each from 0.5 to 6.0 kW;
-regulation ...
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